Plating

In environments with high humidity, and when dissimilar metals are present, it is advised to consider the electrochemical potential between the shield gasket and the metal in contacts. To prevent galvanic action and its corrosive effects at these points of electrical contact, Omega Shielding offers a complete selection of electronic grade platings. Such surface treatment may be considered when the dissimilar metal's potential is great between the gasket and its mating surfaces, or to assure against oxidation in harsh environments.

For example, unplated Beryllium Copper may perform well with the metals in GROUP 2, but tin plating is recommended for use with GROUP 3 metals.

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Inches Millimeters

Gap: The space between mounting and mating surfaces when in the compressed position.

Gap Size:

Mount Size: The amount of available space for mounting the part, including space for expansion of product when compressed.

Mount Size:

Mount Method: The desired method of attachment (i.e. clip-on, transfer adhesive, conductive transfer adhesive, solder, weld, or the use of hardware)

Mount Method: -- Mount Method --

Resources

• Conductive Adhesive Transfer Tape
• Pressure Sensitive Adhesive Transfer Tape
• Copper Beryllium
• Copper Nickel Tin
• Kimmel Gerke Associates, Ltd.
• IEEE
• RoHS

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